报告内容： Heat dissipation is a major safety concern for many industrial applications from nuclear power reactors to computing infrastructure. Take data center—which is responsible for about 2% of the total global electricity use in 2016—for example, cooling costs account for a significant portion (as high as 50%) of that energy consumption. Hence, it is of vital interests to develop of high-efficiency reliable thermal management system so as to address the great economic and environment concerns humanity faces in the times of urgent climate crisis. Thanks to the large latent heat of vaporization, boiling proves to be hundreds of times more efficient than either heat conduction or convection. Notwithstanding, we still lack a complete mechanistic understanding of the boiling phenomenon given the inherent complexity involved in the multiscale multiphase process. Conventional enhancement of boiling heat transfer relies on largely empirical modifications to the boiling surface, including microchannels, porous structure, and reentrant cavities. In this talk, I will give you an overview of recent advances in boiling enhancement using surface wettability engineering. Active control of bubble behavior can be achieved by wettability patterning, which entails attractive characteristics such as promotion of bubble nucleation due to surface hydrophobicity and effective suppression of excessive bubble spreading due to surface hydrophilicity. Consequently, surface design taking advantage of heterogeneous wettabilities can lead to consistently efficient boiling performance under various scenarios. |
